International. Demand for innovative cooling solutions is on the rise in sectors such as data centers, noting that liquid cooling (LC) is emerging as a particularly promising option.
The manufacturer has specified that the phenomenon is justified because the increasing use of high-performance computers poses new challenges to the cooling infrastructure, adding that the efficient and reliable management of extremely high thermal loads is of great importance.
"To meet the growing demand for computing power, driven by AI-based services, advanced analytics, and continuous digitization, processor capabilities are experiencing exponential growth. This generates an increasing thermal load per rack, which requires solutions that can manage this heat efficiently and at the same time require less physical space for identical computing power," the company explained.
Why Liquid Cooling?
This type of solution is characterized by a higher thermal load density that allows for an exponential growth in processor capacities driven by AI and a higher thermal load per rack, in addition to providing more computing power in less physical space.
Connectivity is another key factor. According to Stulz, liquid cooling is up to 1,000 times more efficient than air. In addition, liquid cooling allows for higher operating temperatures per rack, supports free cooling, and simplifies heat reuse.
Finally, liquid cooling improves energy efficiency and promotes sustainability, allowing for lower PUE and expanding the potential for free cooling while maximizing efficiency in heat reuse.
In addition, the company Stulz describes two types of liquid cooling: direct liquid cooling by chip and immersion cooling.
Direct Liquid Cooling by Chip (DCLC)
Central to this technology is the strategic placement of cooling plates directly above heat sources, particularly processors in server units. This proximity ensures fast and precise heat transfer, thus optimizing cooling efficiency. The cooling process is facilitated by a network of small tubes that conduct a liquid coolant directly to the processors.
Once absorbed by the liquid refrigerant, the heat is quickly removed and circulated through refrigerant distribution units to a recooler. Here, heat is released into the surrounding environment, completing the cooling cycle. While liquid cooling serves as the foundation of the system, a complementary air-cooling component remains essential. Approximately 20-30% of the cooling need is met by air cooling mechanisms, ensuring comprehensive thermal management.
Immersion Cooling
Immersion cooling involves submerging computer equipment, such as servers, completely in a non-conductive liquid. Normally, this liquid is housed inside an insulated tank, ensuring efficient heat dissipation. The heat generated by the submerged equipment is absorbed by the liquid.
To maintain optimal operating temperatures, the heated liquid is cooled by an external or internal heat exchanger, which in turn is connected to a recooler. Even with this technology, a complementary air cooling component is still indispensable. Approximately 5% of the thermal load is covered by air-cooled systems.
